BS EN 60749-21-2005 半导体器件.机械和气候试验方法.软钎焊性
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【英文标准名称】:Semiconductordevices-Mechanicalandclimatictestmethods-Solderability
【原文标准名称】:半导体器件.机械和气候试验方法.软钎焊性
【标准号】:BSEN60749-21-2005
【标准状态】:作废
【国别】:英国
【发布日期】:2005-12-05
【实施或试行日期】:2005-12-05
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:温度变化;气候;气候试验;部件;尺寸;电气工程;电学测量;电子工程;电子设备和元件;环境;环境测试;杂质;集成电路;机械测试;耐力;半导体器件;半导体;模拟;表面安装设备;软钎焊性;钎焊;表面安装;温度;测试;外观检查(测试)
【英文主题词】:Changesoftemperature;Climate;Climatictests;Components;Dimensions;Electricalengineering;Electricalmeasurement;Electronicengineering;Electronicequipmentandcomponents;Environment;Environmentaltesting;Environmentaltests;Impurities;Integratedcircuits;Mechanicaltesting;Resistance;Semiconductordevices;Semiconductors;Simulation;SMD;Solderability;Solderings;Surfacemounting;Temperature;Testing;Visualinspection(testing)
【摘要】:ThispartofIEC60749establishesastandardprocedurefordeterminingthesolderabilityofdevicepackageterminationsthatareintendedtobejoinedtoanothersurfaceusingtin-lead(SnPb)orlead-free(Pb-free)solderfortheattachment.Thistestmethodprovidesaprocedurefor‘dipandlook’solderabilitytestingofthroughhole,axialandsurfacemountdevices(SMDs)aswellasanoptionalprocedureforaboardmountingsolderabilitytestforSMDsforthepurposeofallowingsimulationofthesolderingprocesstobeusedinthedeviceapplication.Thetestmethodalsoprovidesoptionalconditionsforageing.Thistestisconsidereddestructiveunlessotherwisedetailedintherelevantspecification.
【中国标准分类号】:L40
【国际标准分类号】:31_080_01
【页数】:24P.;A4
【正文语种】:英语
【原文标准名称】:半导体器件.机械和气候试验方法.软钎焊性
【标准号】:BSEN60749-21-2005
【标准状态】:作废
【国别】:英国
【发布日期】:2005-12-05
【实施或试行日期】:2005-12-05
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:温度变化;气候;气候试验;部件;尺寸;电气工程;电学测量;电子工程;电子设备和元件;环境;环境测试;杂质;集成电路;机械测试;耐力;半导体器件;半导体;模拟;表面安装设备;软钎焊性;钎焊;表面安装;温度;测试;外观检查(测试)
【英文主题词】:Changesoftemperature;Climate;Climatictests;Components;Dimensions;Electricalengineering;Electricalmeasurement;Electronicengineering;Electronicequipmentandcomponents;Environment;Environmentaltesting;Environmentaltests;Impurities;Integratedcircuits;Mechanicaltesting;Resistance;Semiconductordevices;Semiconductors;Simulation;SMD;Solderability;Solderings;Surfacemounting;Temperature;Testing;Visualinspection(testing)
【摘要】:ThispartofIEC60749establishesastandardprocedurefordeterminingthesolderabilityofdevicepackageterminationsthatareintendedtobejoinedtoanothersurfaceusingtin-lead(SnPb)orlead-free(Pb-free)solderfortheattachment.Thistestmethodprovidesaprocedurefor‘dipandlook’solderabilitytestingofthroughhole,axialandsurfacemountdevices(SMDs)aswellasanoptionalprocedureforaboardmountingsolderabilitytestforSMDsforthepurposeofallowingsimulationofthesolderingprocesstobeusedinthedeviceapplication.Thetestmethodalsoprovidesoptionalconditionsforageing.Thistestisconsidereddestructiveunlessotherwisedetailedintherelevantspecification.
【中国标准分类号】:L40
【国际标准分类号】:31_080_01
【页数】:24P.;A4
【正文语种】:英语
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